Groundbreaking of India’s First Advanced 3D Semiconductor Packaging Unit in Odisha; Major Boost to AI, 5G and Defence Tech

In a defining moment for India’s semiconductor ambitions and Odisha’s emergence as a future-ready technology destination, the foundation stone for the country’s first advanced 3D chip packaging unit was laid today at Info Valley, Bhubaneswar. The project marks a significant step towards strengthening India’s domestic semiconductor ecosystem and advancing the vision of Atmanirbhar Bharat in high-end electronics manufacturing.